发明名称 HEAT DISSIPATION MODULE
摘要 A heat dissipation module suitable for performing heat dissipation on a heat source is provided. The heat dissipation module includes a first base, a first radiator, a thermoelectric cooler and a second radiator. The first base has a first surface and a second surface, wherein the first surface contacts the heat source. Both the first radiator and the thermoelectric cooler contact the second surface, while the second radiator is disposed on the thermoelectric cooler.
申请公布号 US2007163269(A1) 申请公布日期 2007.07.19
申请号 US20060564854 申请日期 2006.11.30
申请人 ASUSTEK COMPUTER INC. 发明人 CHUNG CHAO-TSAI;CHANG KUO-HUA
分类号 F25B21/02 主分类号 F25B21/02
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