发明名称 PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for adequately barrel-plating an article to be plated by inhibiting foreign materials from depositing on the article, by sufficiently stirring a plating solution in a plating tank while preventing plating failure from occurring due to a plume of the articles risen in a barrel and consequent insufficient energization to the article. SOLUTION: This plating apparatus has a buffering member 9 for buffering the flow of the plating solution arranged therein so that the flow of the plating solution spouted from an outlet 7 for spouting the plating solution into the plating tank 4 may not affect the movement of the article 1 to be plated in the barrel 2. The buffering member 9 is formed by using such a tabular material as not to pass the plating solution therethrough. Alternatively, the buffering member 9 is formed by using such a material as to pass the plating solution therethrough. The buffering member 9 is formed by using such a mesh material as to pass the plating solution therethrough. The buffering member 9 is formed by using a tabular material having such a through-hole as to pass the plating solution therethrough. The buffering member 9 is arranged so as to cover a main part of the barrel. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007182613(A) 申请公布日期 2007.07.19
申请号 JP20060001881 申请日期 2006.01.06
申请人 MURATA MFG CO LTD 发明人 OKURA TAKESHI;AOKI KENICHI;SUMIKATA MASARU
分类号 C25D17/00;C25D17/20 主分类号 C25D17/00
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