| 摘要 |
PROBLEM TO BE SOLVED: To move the substrate between the cooling plate and the heating plate, and to contrive thinning of a heating device, by levitating a substrate from a cooling plate and a heating plate by gas and moving the substrate into horizonal direction, in the heating device equipped with the cooling plate and the heating plate. SOLUTION: In the heating device 2, discharging holes 3a, 6a are formed for discharging gas to levitate the substrate obliquely upward toward the cooling plate 3 side of a wafer W moving passage, on the cooling plate 3 and the heating plate 6 along the moving passage of the wafer W. The rear side of the wafer W is pushed upon moving the wafer W by a pushing member 51 against a pushing force of the wafer W, by discharging gas from the discharging holes 3a, 6a to move the wafer W to the side of the heating plate 6, on the side opposite to the discharge direction of the gas. Furthermore, the pushing member 51 is moved to the side of the cooling plate 3 in the same direction as the gas discharge direction, under the conditions that the pushing member 51 is pushed by the front side of the wafer W upon moving the wafer W by the discharge of gas from the discharging holes 3a, 6a. COPYRIGHT: (C)2007,JPO&INPIT
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