| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device capable of directly connecting a semiconductor element to a printed circuit board, etc., without using a foundation substrate when a semiconductor element is packaged so that an element formation surface may face up. SOLUTION: A bump electrode 20 for electrical connection on the side of the element formation side is disposed on the element formation surface of a semiconductor element 1. In addition, a pad electrode 2 is disposed in an outside region of a region in which the bump electrode 20 is disposed in the element formation surface of the semiconductor element 1. A through hole 1a passing through the semiconductor element 1 is formed immediately under the pad electrode 2. A bump 6a is formed in the through hole 1a, and this bump 6a is projected from a back surface of the semiconductor element 1. COPYRIGHT: (C)2007,JPO&INPIT
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