| 发明名称 |
NON-CONTACT IC TAG, AND MANUFACTURING METHOD AND APPARATUS THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag on which a fine IC chip can be mounted. <P>SOLUTION: An adhesive layer is formed on a base material (2), a conductive layer (3) with a prescribed pattern is stuck to the surface of the adhesive layer of the base material (2), a narrow gap (7) is formed on the pattern of the conductive layer (3), and an IC chip 8 is arranged on the pattern of the conductive layer (3) straddling over the gap (7). <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007183909(A) |
申请公布日期 |
2007.07.19 |
| 申请号 |
JP20060188914 |
申请日期 |
2006.07.10 |
| 申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SAKATA HIDETO;IGARASHI AKIHIKO;HASEGAWA SAKAE |
| 分类号 |
G06K19/077;G06K19/07;H05K1/02;H05K1/11;H05K1/18;H05K3/00;H05K3/28;H05K3/32 |
主分类号 |
G06K19/077 |
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