发明名称 METHOD FOR CUTTING GLASS SUBSTRATE, AND CUTTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a glass substrate-cutting method and its apparatus surely and efficiently discharging and removing fine glass cullet occurred when forming a cutting line on the surface of a plate glass by the run of a cutter without adherence to the glass surface. SOLUTION: The glass substrate-cutting method comprises scribing the surface 1a of a glass substrate 1 as a cutting line 2 by running a cutter 17a along the surface 1a, and cutting the substrate 1 along the cutting line 2, in particular scribing by jetting a water stream on the surface 1a of the substrate 1 from the scribe-scheduled place of the cutting line 2 toward the side of the cutter 17a, and running it while forming the water film of an aqueous solution 22 on the above scheduled place. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007182338(A) 申请公布日期 2007.07.19
申请号 JP20060000432 申请日期 2006.01.05
申请人 KYOKUHEI GLASS KAKO KK 发明人 HIRABAYASHI TAKAO
分类号 C03B33/023;B28D1/24;B28D7/02 主分类号 C03B33/023
代理机构 代理人
主权项
地址