发明名称 |
DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A double encapsulated semiconductor package and manufacturing methods of forming the same are provided. Embodiments of the semiconductor package include a complex chip having normal and random pads formed on its active surface, the complex chip being attached to a first surface of a wiring substrate. First and second windows are formed in the wiring substrate to respectively expose the normal and random pads, and to allow bonding wires to be connected to the normal and random pads with the wiring substrate. A first resin encapsulation portion is formed by a molding method in the first window and a second resin encapsulation portion is formed by a potting method in the second window.
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申请公布号 |
US2007164407(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20060464359 |
申请日期 |
2006.08.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUN BYUNG-SEOK;KIM GIL-BEAG;LEE YONG-JIN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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