| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure system and an exposure method capable of improving superposition accuracy while preventing deterioration in throughput, and a device manufacturing method employing the exposure system or the exposure method. <P>SOLUTION: This exposure system includes an exposure unit 1 provided with a wafer stage WST for placing a wafer holder WH for holding a wafer W and exposing a pattern DP of a reticle R on the wafer W, a measurement unit 2, and a carrying apparatus 3. The measurement unit 2 is provided with a plurality of sensors 31, and simultaneously measures a plurality of alignment marks AM formed on different positions on the wafer W held on the wafer holder WH before being held by the wafer stage WST of the exposure unit 1. The carrying apparatus 3 carries the wafer holder WH for holding the wafer W between the measurement unit 2 and the exposure unit 1. <P>COPYRIGHT: (C)2007,JPO&INPIT |
