| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a size of chip size and comprises a multichip module. <P>SOLUTION: The semiconductor device 21 includes a first semiconductor chip 3 which possesses a first functional surface 3F wherein a first functional device 3a is formed, and a first backside 3R opposite to the first functional surface 3F; and a second semiconductor chip 2 which possesses a second functional surface 2F wherein a second functional device 2a is formed. The second functional surface 2F has a region opposite to the first functional surface 3F and a non-countering region 7 not opposite to the first functional surface 3F. An insulating film 22 is formed continuously so as to cover the non-countering region 7 and the first backside 3R of the first semiconductor chip 3. Rewiring 9 electrically connected to the second functional device 2 is formed on the surface of the insulating film 22, a protective resin 12 is arranged so as to cover the rewiring 9. The protective resin 12 is penetrated from the rewiring 9 so that external connection terminals 10 are set up vertically. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
