| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound structure (50) of a z-axis interconnection. SOLUTION: The compound structure (50) includes a plurality of layers (40) of backings alternately arranged between a plurality of interconnection layers (38). The Interconnection layers (38) are structured so as to facilitate the connection of the compound structure (50) of the z-axis interconnection to a transducer array. The compound structure (50) of the z-axis interconnection is structured so as to be used in an invasive probe. A transducer assembly provided in the other mode of this invention includes the compound structure of the z-axis interconnection and the transducer array arranged close to the compound structure of the z-axis interconnection. The transducer array has one or a plurality of transducer elements arranged in the array. The transducer array can operate in connection with the compound structure of the z-axis interconnection. The transducer assembly is structured so as to be used in the invasive probe. COPYRIGHT: (C)2007,JPO&INPIT |
