| 摘要 |
PROBLEM TO BE SOLVED: To secure the operational reliability of a semiconductor chip by preventing the peeling-off of a heat sink by fixing it to a substrate with sufficient strength. SOLUTION: Fixing faces 105b of the heat sink 105 have such a structure that the top and bottom faces are put between an adhesive resin 106. Due to this structure, the fixing area of the heat sink can be increased compared with the conventional case wherein the bottom face of the heat sink and the top face of the substrate have only been fixed together by an adhesive resin. Consequently, the heat sink 105 can be fixed to the top face of the substrate 101 with more sufficient strength. COPYRIGHT: (C)2007,JPO&INPIT
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