| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device capable of securing sealing performance and radiation while permitting the reduction of cost. SOLUTION: The electronic device 100 comprises a circuit substrate 10, a package constituted of a case 20 for receiving the circuit substrate 10 and a base 30, a sealing member 40 interposed between the case 20 and the base 30 to make a space for receiving the circuit substrate 10 as a waterproofing space, and a heat conductive member 50 interposed between the base 30 and the rear surface of an electronic component mounting site in the printed circuit substrate 11 while being provided with flexibility. A heat generating element 12a is mounted on the peripheral site of the printed circuit substrate 11 while a projection 35 is provided as constituted integrally with a part of the base 30 by press work between the arranging site of the heat conductive member 50 and the arranging site of the seal member 40 on the base 30 formed through press work, while being projected on the internal surface side with respect to the arranging site of the heat conductive member 50. COPYRIGHT: (C)2007,JPO&INPIT
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