| 摘要 |
PROBLEM TO BE SOLVED: To form wirings of low specific resistance at a low temperature of 150°C or less on a substrate continuously. SOLUTION: By using a conductive paste 13 containing a conductive powder A of which apparent density is 0.4 g/cm<SP>3</SP>or more and 1.4 g/cm<SP>3</SP>or less, a conductive powder B of which the apparent density is 1.5 g/cm<SP>3</SP>or more, at least one resin C chosen from a resin of which glass transition temperature is 60°C or less, a resin of an elastomer state at room temperature, and a resin in a wax state at room temperature, a compound D having a reaction group, and a curing agent E of the compound D, a wiring pattern 14 is formed on the PET substrate 10. The wiring pattern 14 is heated at a temperature of 150°C or less, and by applying a roll treatment on the wiring pattern 14 after heating at a temperature of 60°C or more and 130°C or less and at a pressure of 0.1 MPa or more and 0.5 MPa or less, a wiring board 17 is fabricated. COPYRIGHT: (C)2007,JPO&INPIT
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