发明名称 |
Semiconductor package and process for making the same |
摘要 |
A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.
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申请公布号 |
US2007164402(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20060332891 |
申请日期 |
2006.01.17 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
JUNG DAE-HOON;LEE SEOK-WON;PARK SANG-BAE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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