| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern formation method for enlarging freedom of design regarding a formation material and an object of a thick film pattern and for enhancing its productivity, and a droplet ejection apparatus. SOLUTION: A droplet is ejected to a sub-cell C2 opposed to an outer edge of a dot formation area S and the droplet is irradiated with a UV ray to form a fixed dotlet Dp at the timing that an outer diameter of the deposited droplet becomes a width of the sub-cell C2, i.e., a fixed width Rp. Further, a plurality of droplets are ejected to an area surrounded by the fixed dot Dp (dot formation area S) and The plurality of adjusted droplets are irradiated with the UV ray to form a filled dot Df. COPYRIGHT: (C)2007,JPO&INPIT
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