| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer foreign matter inspection technique which can be specified a size and a shape of the foreign matter. SOLUTION: A wafer 1 is irradiated slantingly by an inspection light irradiation device 20. A foreign matter inspection device 10 which can specify a coordinate position of the foreign matter 5 by detecting a scattering light 31 of the inspection light 21 on the wafer 1 under a dark light field with a scattered light detector 34 is loaded with an epi-illumination device 40 and an imaging device 45. The coordinate position of the foreign matter 5 specified by a foreign matter judgement device 35 based on the detection of the scattered light detector 34 is imaged by the imaging device 45 under a bright light field lighting by the epi-illumination device 40, and from this image, the foreign matter image is extracted. Additionally, from this extracted foreign matter image, a size, a shape, a color, a character of the foreign matter are specified. The size, the shape, the color, and the character of the foreign matter can be specified only by the foreign matter inspection device, a review of the foreign matter can be performed surely, rapidly, and cheaply. COPYRIGHT: (C)2007,JPO&INPIT
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