| 摘要 |
A semiconductor package structure and a fabrication method thereof are provided. The fabrication method includes providing a semiconductor chip having an active surface, a inactive surface, and a plurality of bond pads formed on the active surface; coupling one or more substrates to the active surface in such a way that the bond pads are exposed through one or more openings in the one or more substrates and/or gaps between the substrates to electrically connect the bond pads to the substrate; attaching and electrically connecting the semiconductor chip to a leadframe having a plurality of leads; and encapsulating the semiconductor chip, the substrate, and the leadframe with an encapsulant, with at least bottom surfaces of the leads of the leadframe being exposed from the encapsulant. An indented structure is therefore formed on the bottom surface of an inner portion of each of the leads of the leadframe.
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