| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing so as to reduce a fabrication cost and to satisfy various requests on the market. SOLUTION: The method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate 100, forming a first self-assembly membrane (SAM) 103 on at least one side of the substrate, forming a non-adhesive membrane 105 on the first SAM 103, forming at least one microhole 107 in the substrate, forming a second SAM 103 on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern 110 on the substrate. COPYRIGHT: (C)2007,JPO&INPIT |
