| 摘要 |
PROBLEM TO BE SOLVED: To provide a single crystal silicon (SCS) micromechanical resonator formed using a two-wafer process including either a Silicon-on-insulator (SOI) or an insulating base and resonator wafers. SOLUTION: A resonator 106 of the present invention is formed from a SOI base plate 102 formed within a SOI base wafer 104 and a single crystal silicon micromechanical resonator 106 formed within a SOI resonator wafer 108, and the wafer 104 includes an embedded dielectric layer 110 held between a handle layer 112 and an active layer 114. The resonator 106 is disposed above a capacitive air gap 116, and the resonator 106 is bonded, at terminal portions 118, 120, to single crystal silicon anchors 122, 124 formed within the active layer 114 of the base wafer 104 so as to be coupled, at both terminals, to the base plate 102, thereby obtaining a clamped-clamped resonator. COPYRIGHT: (C)2007,JPO&INPIT
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