发明名称 CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
摘要 A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.
申请公布号 US2007164349(A1) 申请公布日期 2007.07.19
申请号 US20060616182 申请日期 2006.12.26
申请人 SANYO ELECTRIC CO., LTD. 发明人 NAKASATO MAYUMI;MURAI MAKOTO;USUI RYOSUKE;MIZUHARA HIDEKI;INOUE YASUNORI
分类号 H01L29/788 主分类号 H01L29/788
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