发明名称 |
CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD |
摘要 |
A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.
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申请公布号 |
US2007164349(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20060616182 |
申请日期 |
2006.12.26 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
NAKASATO MAYUMI;MURAI MAKOTO;USUI RYOSUKE;MIZUHARA HIDEKI;INOUE YASUNORI |
分类号 |
H01L29/788 |
主分类号 |
H01L29/788 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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