Power semiconductor component for e.g. alternating current-direct current converter, has chips arranged adjacent to each other and attached on flat conductor by diffusion solder connection, where another chip is attached on chips

摘要

The component has a chip stack that contains three chips (6, 8, 10). A housing is provided in which the three chips are placed. The chips (6, 8) are arranged adjacent to each other and are attached on a flat conductor (4) by a diffusion solder connection. The chip (10) is attached on the chips (6, 8), where summation of chip surfaces of the chips (6, 8) is smaller than a chip surface of the chip (10). An independent claim is also included for a method for manufacturing a power semiconductor component.