Semiconductor assembly for improved device warpage and solder ball coplanarity

摘要

A semiconductor device with a chip ( 505 ), its position defining a plane, and an insulating substrate ( 503 ) with first and second surfaces; the substrate is substantially coplanar with the chip, without warpage. One of the chip sides is attached to the first substrate surface using adhesive material ( 504 ), which has a thickness. The thickness of the adhesive material is distributed so that the thickness ( 504 b) under the central chip area is equal to or smaller than the material thickness ( 504 a) under the peripheral chip areas. Encapsulation compound ( 701 ) is embedding all remaining chip sides and the portions of the first substrate surface, which are not involved in the chip attachment. When reflow elements ( 720 ) are attached to the substrate contact pads, they are substantially coplanar with the chip.