发明名称 |
Enhanced step coverage of thin films on patterned substrates by oblique angle PVD |
摘要 |
A method and an apparatus for fabricating an integrated circuit entail directing a vapor flux toward a substrate surface from a plurality of directions associated with a plurality of azimuth angles, and selecting a deposition angle of the vapor flux, relative to a normal incidence, to obtain a substantially conformal film. The surface feature can be associated with, for example, one or more vias and/or one or more trenches.
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申请公布号 |
US7244670(B2) |
申请公布日期 |
2007.07.17 |
申请号 |
US20040872083 |
申请日期 |
2004.06.18 |
申请人 |
RENSSELAER POLYTECHNIC INSTITUTE |
发明人 |
KARABACAK TANSEL;LU TOH-MING;BARTHEL JOHN ROBERT |
分类号 |
H01L21/20;C23C14/00;C23C14/04;C23C14/50;H01L21/285;H01L21/31;H01L21/768 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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