Multi-layer integrated circuit package

摘要

Adhesive material is applied to a surface of a metallic core layer. The adhesive material is removed from a conductive region of the metallic core layer. A metallic contact is provided over the conductive region of the metallic core layer. The metallic core layer is laminated to an imprinted buildup layer, the buildup layer having a dielectric region and a conductive region, wherein a nonconductive region of the metallic core layer is bonded to the dielectric region of the buildup layer and the conductive region of the metallic core layer is bonded to the conductive region of the imprinted-buildup layer.