发明名称 Stacked package electronic device
摘要 An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.
申请公布号 US7245003(B2) 申请公布日期 2007.07.17
申请号 US20040880998 申请日期 2004.06.30
申请人 INTEL CORPORATION 发明人 LI DELIN
分类号 H01L23/552 主分类号 H01L23/552
代理机构 代理人
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