发明名称 |
Apparatus and method for opening a sealed module containing a circuit board |
摘要 |
An apparatus and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base to support the housing and a force transmitter to transmit a separation force to the exposed surfaces of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The invention also includes steps for separating the circuit board from the housing including, in one embodiment, a separator apparatus for applying a pulling force to the connectors of the circuit board.
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申请公布号 |
US7243418(B2) |
申请公布日期 |
2007.07.17 |
申请号 |
US20040872790 |
申请日期 |
2004.06.22 |
申请人 |
CUMMINS, INC. |
发明人 |
MURILLO, JR. TOMAS;CHAIREZ FRANCISCO;MONREAL JOSE |
分类号 |
B25B27/14;B23P19/00;H01R13/635 |
主分类号 |
B25B27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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