发明名称 APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE OF MOLD
摘要 An apparatus and a method for controlling a temperature of a mold are provided to reduce manufacturing cost and minimize a space for installation by directly supplying a heat source to the mold and excluding a separate heating device. An apparatus for controlling a temperature of a mold(10) includes the mold, a heat source supplying pipe(2), a cooling water supplying pipe(4), an air supplying pipe(6), a discharging pipe(7), and a controlling unit(8). The mold has an inlet(13) and an outlet(15) connected with an inner path, and has first and second temperature sensors(16,17). The heat source supplying pipe is connected with the inlet of the mold, and supplies a heat source to the mold with a proportional controlling valve(22). The cooling water supplying pipe is connected with the heat source supplying pipe, and supplies cooling water to the mold with an opening/shutting valve(42,62). The air supplying pipe is connected with the heat source supplying pipe, and supplies air to the mold with the opening/shutting valve which opens/shuts a pipe path before being connected with the heat source supplying pipe. The discharging pipe is connected with the outlet of the mold. The controlling unit controls the proportional controlling valve and the opening/shutting valve installed at the heat source supplying pipe, the cooling water supplying pipe, and the air supplying pipe.
申请公布号 KR100741661(B1) 申请公布日期 2007.07.16
申请号 KR20060024860 申请日期 2006.03.17
申请人 BOOYEO TEMPCON CO., LTD. 发明人 KIM, DONG HAK
分类号 B29C45/78;B29C45/76 主分类号 B29C45/78
代理机构 代理人
主权项
地址