发明名称 SEMICONDUCTOR CHIP AND SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To inspect a highly integrated semiconductor integrated circuit efficiently and reliably. SOLUTION: When a test signal from a probe is inputted to a probe pad 12<SB>SDATA-in</SB>, the test signal is distributed to selectors 27A-27N via a selector 24A, and is inputted to each terminal of a DRAM 21 via respective buffer circuits 28A-28N. Therefore, a memory chip 10 distributes the test signals in parallel, and supplies each test signal to wiring connected to microbumps 11A<SB>in</SB>-11B<SB>in</SB>, and hence the memory chip 10 can input test signals inputted to a single probe pad 12<SB>SDATA-in</SB>to each terminal of the DRAM 21 simultaneously. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007178396(A) 申请公布日期 2007.07.12
申请号 JP20050380239 申请日期 2005.12.28
申请人 SYSTEM FABRICATION TECHNOLOGIES INC 发明人 KUMAGAI KOICHI
分类号 G01R31/28;H01L21/66;H01L21/822;H01L27/04 主分类号 G01R31/28
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