摘要 |
PROBLEM TO BE SOLVED: To inspect a highly integrated semiconductor integrated circuit efficiently and reliably. SOLUTION: When a test signal from a probe is inputted to a probe pad 12<SB>SDATA-in</SB>, the test signal is distributed to selectors 27A-27N via a selector 24A, and is inputted to each terminal of a DRAM 21 via respective buffer circuits 28A-28N. Therefore, a memory chip 10 distributes the test signals in parallel, and supplies each test signal to wiring connected to microbumps 11A<SB>in</SB>-11B<SB>in</SB>, and hence the memory chip 10 can input test signals inputted to a single probe pad 12<SB>SDATA-in</SB>to each terminal of the DRAM 21 simultaneously. COPYRIGHT: (C)2007,JPO&INPIT
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