发明名称 TERMINAL HAVING BARRIER SECTION AGAINST SOLDER SOAKING UP, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a terminal having a new barrier section against solder soaking up which has high solder soaking up prevention effect, and its manufacturing method. SOLUTION: This terminal has the barrier section against solder soaking up, and C of 50-70% and Ni of 20-40% on an average are detected from various regions when measured by an Auger electron spectrometer. This terminal is manufactured by a method performing the following processes of (a)-(c) one by one: (a) a process in which nickel backing plating and finishing gold plating is applied to the base material of the terminal, (b) a process in which the surface of the terminal is treated by a sealing treatment liquid containing C in its components, (c) a process in which one or more spots of the terminal are irradiated with laser and the barrier sections against solder soaking up are formed at such spots. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007179922(A) 申请公布日期 2007.07.12
申请号 JP20050378385 申请日期 2005.12.28
申请人 NIKKO FUJI ELECTRONICS CO LTD 发明人 SHIBUYA NORIMITSU
分类号 H01R13/03;B23K1/00;H01R43/16 主分类号 H01R13/03
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