| 摘要 |
To improve the throughput of the entire exposure process. [SOLUTION] While wafer stage WST moves from a loading position where wafer W on wafer stage WST is exchanged to an exposure starting position where exposure of a wafer begins, at least a part of alignment systems ALG 1 and ALG 2 are moved and marks on wafer W are detected using alignment systems ALG 1 and ALG 2 . Accordingly, time for mark detection does not have to be arranged separately from the movement time of the stage from the loading position to the exposure starting position, as in the conventional apparatus. Therefore, it becomes possible to increase the throughput of the entire exposure process.
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