| 摘要 |
A simplified image sensor module package includes a flexible print circuit board having an upper surface, which is formed with a plurality of electrically circuits, and a lower surface. A frame layer is arranged on the upper surface of the flexible print circuit board. A chip is mounted on the upper surface of the flexible print circuit board. A plurality of wires are electrically connected the chip to the electrical circuits of the flexible print circuit board. A transparent layer is mounted on the frame layer to cover the chip. A lens holder is mounted on the frame layer, and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder.
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