| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin and small optical semiconductor device excellent in heat radiation properties, and stable in production. <P>SOLUTION: In a die pad side inner lead 4, a die pad mounting an optical semiconductor element is provided from the projecting end of the lead to a middle part, and a first bent part 21 is bent at about 40° so as to incline from a face made by a die pad to a main face mounting the optical semiconductor element. A second bent part 22 is provided at a location higher in 400 μm than the first bent part 21, and is caused to again extend to the same direction as the die pad. A die pad side outer lead 7 is located in the extending region of the inner lead 4 extending from the second bent part 22 to extend horizontally in an area outside of an envelope. A third bent part 23 provided in the middle part is bent toward a direction intersecting with a virtual plane containing the rear face of the die pad. <P>COPYRIGHT: (C)2007,JPO&INPIT |
