发明名称 LIGHT-EMITTING MODULE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting module that can be suitably machined by using a metal lead frame, an insulator, and a metal plate in place of a ceramic substrate, and to provide a manufacturing method of the light-emitting module. <P>SOLUTION: A metal substrate 112 is integrated with the lead frame 100, mainly formed of copper, in which a recess 116 is formed via a heat radiation resin 102 that is an insulating layer containing inorganic filler and a resin composition containing a thermosetting resin halfway. An LED 108 is packaged in the lead frame 100. As a result, the heat generated by the LED 108 is radiated by the lead frame 100, and the lead frame is folded partially as a folded section 110, thus improving the mechanical strength when the light-emitting module is packaged. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007180318(A) 申请公布日期 2007.07.12
申请号 JP20050377947 申请日期 2005.12.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUMURA TETSUYA;NISHIYAMA KIMIHARU;TSUJIMOTO ETSUO;NAKAO KEIICHI
分类号 H01L33/56;H01L33/58;H01L33/60;H01L33/62 主分类号 H01L33/56
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