发明名称 WIRING BOARD FOR MOUNTING MILLIMETER-WAVE SEMICONDUCTOR CHIP
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting millimeter-wave semiconductor chip, wherein electrostatic breakage are prevented from occurring occurs in a millimeter-wave basic element, even if electrostatic electricity is applied to an external terminal to which a millimeter-wave signal is input. <P>SOLUTION: Transmission line conductors 12 and 13 for transmitting a millimeter-wave signal are electrically brought into contact with a silicon board 11 with a resistivity of 0.5-10.5 k&Omega; cm, to which the millimeter-wave semiconductor chip 14 is mounted, so as to form the wiring board for mounting a millimeter-wave semiconductor chip. When electrostatic electricity is input to an external terminal 16, it is made to flow to an earth conductor 13 via a route formed in the silicon substrate 11. Thus, the electrostatic breakdown voltage of the millimeter-wave semiconductor chip 14 is improved significantly. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007180119(A) 申请公布日期 2007.07.12
申请号 JP20050374207 申请日期 2005.12.27
申请人 OKI ELECTRIC IND CO LTD 发明人 SEKI SHOHEI
分类号 H01L23/12;H01P3/02;H01P3/08 主分类号 H01L23/12
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