| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip having improved shock resistance as compared with before. SOLUTION: The semiconductor chip 1 has a nearly rectangular plane shape, and two long sides 11a for forming an active surface 10a and two long sides 11b for forming the back are polished. Even if cracks, cutouts, or the like are formed in four long sides 11a, 11b when cutting out the semiconductor chip 1 from a silicon wafer, the cracks, cutouts, or the like can be removed by polishing in the semiconductor device, thus improving shock resistance as compared with before. Two short sides 12a for forming the active surface 10a and two short sides 12b for forming the back may be polished further. COPYRIGHT: (C)2007,JPO&INPIT |
