| 摘要 |
A circuit board device with a fine conductive structure is proposed. A circuit board having at least a circuit layer is provided and the circuit layer has at least one electrically conductive pad. At least one first dielectric layer is formed on surfaces of the circuit board and the circuit layer and has at least one opening to expose the electrically conductive pad of the circuit layer. At least a first fine conductive structure made of conductive material with high ductility is formed in the opening of the first dielectric layer and is electrically connected to the electrically conductive pad of the circuit layer. The top surface of the first fine conductive structure is higher than, level with or lower than the surface of the first dielectric layer. Moreover, a conductive pad may be further formed on the top surface of the first fine conductive structure. Since the first fine conductive structure is made of conductive material with high ductility, the stress strength of the first fine conductive structure is reinforced and the electrically connecting quality between layers of the circuit board is improved. |
