| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which can ensure high precision alignment and highly reliable bonding even when a large component is bonded onto a dielectric substrate. SOLUTION: At least a scheduled component bonding region on a dielectric substrate 1 is coated with films 2 and 3 composed of a dielectric which deforms through heat treatment, and protrusions 5 composed of a dielectric are formed at positions on the films spaced apart by a substantially fixed dimension along the profile of a component 8 being bonded. In the scheduled component bonding region on the film surrounded by the protrusions 5, a large component 8 to be bonded is mounted and heat treated. A portion of the protrusion 5 is fluidized to fixedly bond the component 8 to be bonded. COPYRIGHT: (C)2007,JPO&INPIT
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