| 发明名称 |
Electronic circuit package |
| 摘要 |
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor
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| 申请公布号 |
US2007158814(A1) |
申请公布日期 |
2007.07.12 |
| 申请号 |
US20070714747 |
申请日期 |
2007.03.07 |
| 申请人 |
KANEKAWA NOBUYASU;IHARA HIROKAZU;AKIYAMA MASATSUGU;KAWABATA KIYOSHI;YAMANAKA HISAYOSHI;OKISHIMA TETSUYA |
发明人 |
KANEKAWA NOBUYASU;IHARA HIROKAZU;AKIYAMA MASATSUGU;KAWABATA KIYOSHI;YAMANAKA HISAYOSHI;OKISHIMA TETSUYA |
| 分类号 |
G06F1/18;H01L23/02;G06F3/00;G06F11/10;G06F11/22;G06F12/16;G06F15/78;G11C5/00;H01L23/48;H01L23/495;H01L23/50;H01L23/52;H01L23/538;H01L25/04;H01L25/065;H01L25/18 |
主分类号 |
G06F1/18 |
| 代理机构 |
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