LEITERPLATTE, MEHRSCHICHTIGE LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG

摘要

Each via hole of a printed wiring board is filled with a metal conductor. A distal end of each metal conductor is covered with a diffusing metal layer. The distal end of the metal conductor is pressed against a conductor circuit of another substrate, and the printed wiring boards are bonded together by thermocompression bonding. The metal of the distal end of each metal conductor is diffused into the metal of the conductor circuit so that an alloy layer is formed in an interface. As a result, reliability in the interlayer electrical connection can be improved.