| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent variation in the thickness of solder in each of junctions, compared to a soldering method in which each semiconductor device is pressed to a circuit board side by an individual weight in soldering a plurality of semiconductor devices on the circuit board. <P>SOLUTION: A semiconductor module 100 includes at least three semiconductor devices 12 which are not arranged on a straight line in the circuit board 11. In the soldering process, the semiconductor devices 12 are each arranged through a soldering sheet 33 on a junction provided on the circuit board 11, and a weight 35 is placed so as to stride over at least three semiconductor devices 12 which are not arranged on a straight line. Soldering is executed in such a way that a molten solder can reach the entire surface of the semiconductor devices 12 opposite to the junction while pressing the semiconductor elements 12 by the weight 35. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
