| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit member manufacturing method for improving production efficiency while suppressing an increase in manufacturing cost for a circuit member in the circuit member manufacturing method used for a semiconductor device. SOLUTION: When a rough surface is formed at a part in a lead frame material 1 contacting with a sealing resin in order to improve adhesion strength in between the sealing resin by using a microetching solution, an Ag-plating layer is formed on the whole face of the upper face, the side faces, and the lower face of the lead frame material 1; the Ag-plating layer at a part for forming the rough surface is partially subjected to electrolytic stripping, and the rough surface is formed at the contact between the lead frame material and the sealing resin while executing microetching processing by making the Ag-plating layer as a mask. After that, the Ag-plating layer is wholly stripped. COPYRIGHT: (C)2007,JPO&INPIT |
