| 摘要 |
PROBLEM TO BE SOLVED: To reduce changes in the vibration characteristics of a diaphragm provided in a semiconductor chip in a semiconductor device provided with the semiconductor chip such as a sound pressure sensor chip, while improving manufacturing efficiency and reducing manufacturing costs. SOLUTION: The semiconductor device 1 comprises a circuit board 3, the semiconductor chip 9 which is arranged on a surface 3a of the circuit board 3 and is provided with a thin-film diaphragm 9a which vibrates in accordance with a fluctuation in pressure, and a nearly plate-shaped spacer 5 which is fixed between the circuit board 3 and the semiconductor chip 9. The spacer 5 is formed with a through hole 17 for allowing the surface 3a of the circuit board 3 and the diaphragm 9a to face each other. COPYRIGHT: (C)2007,JPO&INPIT
|
