发明名称 TRANSPARENT PACKAGING BAG FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a transparent bag suitable for packaging electronic components, which excels in airtightness, vapor barrier properties, and gas barrier properties, etc. SOLUTION: Two sheets of transparent film, in which polyethylene terephthalate film having an inorganic compound deposition layer, polyamide film, and straight-chain low density polyethylene film are laminated together in that order, are superposed so that the straight-chain low density polyethylene film comes inside. The open end of a bag body whose both sides and one end are fused under heat has two parallel plastic zippers disposed parallel to the open end, each zipper having a pair of teeth, one male and the other female. In such a transparent packaging bag for electronic components, both the opening-side plastic zipper and the contents-side plastic zipper are formed such that a continuous fastening wall is formed inside and parallel to the male teeth, and a continuous pressing rib is formed inside and parallel to the female teeth. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007176542(A) 申请公布日期 2007.07.12
申请号 JP20050376562 申请日期 2005.12.27
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 HASEGAWA KATSUHIKO;YOSHIDA SATORU
分类号 B65D33/25;A44B19/16;B65D65/08;B65D65/40;B65D81/24;B65D85/86 主分类号 B65D33/25
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