发明名称 Processing method
摘要 In a processing apparatus which performs a film deposition by alternately supplying a plurality of source gases, the source gases are prevented from reacting within an exhaust pipe so as to prevent the exhaust pipe from clogging due to a reaction by-product. A gas supply to a processing container is switched between a TiCl<SUB>4 </SUB>supply system and a NH<SUB>3 </SUB>supply system. Additionally, a gas exhaust from the processing container is switched between a TiCl<SUB>4 </SUB>exhaust system and a NH<SUB>3 </SUB>exhaust system. The gas exhaust is switched to the TiCl<SUB>4 </SUB>exhaust system when the gas supply is switched to the TiCl<SUB>4 </SUB>supply system, and the gas exhaust is switched to the NH<SUB>3 </SUB>exhaust system when the gas supply is switched to the NH<SUB>3 </SUB>supply system. The switching is performed by a stop valve provided to each of the supply system and the exhaust system.
申请公布号 US2007160757(A1) 申请公布日期 2007.07.12
申请号 US20070717183 申请日期 2007.03.13
申请人 TOKYO ELECTRON LIMITED 发明人 ISHIZAKA TADAHIRO;KANNAN HIROSHI;KOJIMA YASUHIKO;SHIGEOKA TAKASHI;OSHIMA YASUHIRO;KAWAMURA KOHEI
分类号 C23C16/00;C23C16/455;C23C16/34;C23C16/44;H01L21/31 主分类号 C23C16/00
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