发明名称 Polishing Pad with Surface Roughness
摘要 A polishing pad has a polishing layer having a polishing surface with a surface roughness between about 200 and 300 microinches. The polishing pad can be made by forming a polishing layer by extrusion or molding, and grinding a polishing surface of the polishing layer to a surface roughness between about 200 and 300 microinches.
申请公布号 US2007161720(A1) 申请公布日期 2007.07.12
申请号 US20060562375 申请日期 2006.11.21
申请人 APPLIED MATERIALS, INC. 发明人 DONOHUE TIMOTHY J.
分类号 C08G18/00 主分类号 C08G18/00
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