发明名称 |
Light-emitting diode structure with transparent window covering layer of multiple films |
摘要 |
A light-emitting diode structure with transparent window covering layer of multiple films discloses at least a first transparent covering layer and a second covering layer, which are covered with the outside of the light-emitting diode chip. The light-emitting diode chip can emit more than two kinds of light waves to increase the transmission of the different wavelengths and the taking out efficiency of the light-emitting diode. Furthermore, the first transparent covering layer and the second covering layer are deposited each other on the outside of the light-emitting diode chip. The surface of the light-emitting diode with the covering layers is smooth. The contacting parts of the first transparent covering and the second covering layer have strong adhesive force and the contacting parts of the covering layer and light-emitting diode chip also have strong adhesive force.
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申请公布号 |
US2007158667(A1) |
申请公布日期 |
2007.07.12 |
申请号 |
US20060326314 |
申请日期 |
2006.01.06 |
申请人 |
WU LIANG-WEN;TSAI YA-PING;CHIEN FEN-REN |
发明人 |
WU LIANG-WEN;TSAI YA-PING;CHIEN FEN-REN |
分类号 |
H01L29/22;H01L29/24;H01L33/44;H01L33/54;H01L33/56 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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