发明名称 Light-emitting diode structure with transparent window covering layer of multiple films
摘要 A light-emitting diode structure with transparent window covering layer of multiple films discloses at least a first transparent covering layer and a second covering layer, which are covered with the outside of the light-emitting diode chip. The light-emitting diode chip can emit more than two kinds of light waves to increase the transmission of the different wavelengths and the taking out efficiency of the light-emitting diode. Furthermore, the first transparent covering layer and the second covering layer are deposited each other on the outside of the light-emitting diode chip. The surface of the light-emitting diode with the covering layers is smooth. The contacting parts of the first transparent covering and the second covering layer have strong adhesive force and the contacting parts of the covering layer and light-emitting diode chip also have strong adhesive force.
申请公布号 US2007158667(A1) 申请公布日期 2007.07.12
申请号 US20060326314 申请日期 2006.01.06
申请人 WU LIANG-WEN;TSAI YA-PING;CHIEN FEN-REN 发明人 WU LIANG-WEN;TSAI YA-PING;CHIEN FEN-REN
分类号 H01L29/22;H01L29/24;H01L33/44;H01L33/54;H01L33/56 主分类号 H01L29/22
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