Verfahren zur Herstellung von aus monomorphen ferroelektrischen Dünnschichten zusammengesetzten Treibern und Sensoren

摘要

A method for forming ferroelectric wafers (10) is provided. A prestress layer (14) is placed on the desired mold. A ferroelectric wafer (12) is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.