| 发明名称 |
OVERHANG INTEGRATED CIRCUIT PACKAGE SYSTEM |
| 摘要 |
An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the die paddle.
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| 申请公布号 |
US2007158792(A1) |
申请公布日期 |
2007.07.12 |
| 申请号 |
US20060306693 |
申请日期 |
2006.01.06 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND R.;BATHAN HENRY D.;TRASPORTO ARNEL;PUNZALAN JEFFREY D. |
| 分类号 |
H01L23/495;H01L23/02;H01L23/52 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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