| 摘要 |
A signal interface to connect a semiconductor tester to a device under test. The Interface includes a generic component and customized component. The generic component includes multiple copies of electronic elements that can be connected in signal paths between the tester and the device under test. The customized component is constructed for a specific device under test and provides connections between generic contact points on the generic component and test points on the device under test. In addition, the customized component has conductive members that can be used to interconnect the electronic elements on the generic component. The connections configure the electronic elements into signal conditioning circuitry, thereby providing signal paths through the interface that are compatible with the I/O characteristics of specific test points on a device under test. The generic and the customized components may be fabricated on semiconductor wafers. |
