| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus by which a plated film having uniform film thickness is formed on a main substrate by effectively utilizing an auxiliary substrate to improve the distribution of current density on a main substrate. SOLUTION: In the electroplating apparatus having the main substrate arranged in a plating bath, an anode arranged to be opposed to the main substrate with a prescribed interval, the auxiliary substrate arranged on the periphery of the main substrate so as not to be electrically connected to the main substrate and a power source for supplying current respectively between the anode and the main substrate and between the anode and the auxiliary substrate, a plurality of power feeding points from the power source are provided respectively on the main substrate and the auxiliary substrate. COPYRIGHT: (C)2007,JPO&INPIT
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